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MHI's Room-Temperature Bonding Machine for 8-inch Wafers Begins Operation at MEMS Manufacturer in Japan
Tokyo, Apr 8, 2010 - (JCN Newswire) - Mitsubishi Heavy Industries, Ltd. (MHI) has delivered the first unit of the company's fully automated wafer bonding machine capable of bonding 8-inch diameter wafers - substrates of integrated circuits (IC) - at room temperature, to a domestic MEMS manufacturer.
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